Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution

Application number :: 2003237490
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
Inventor :: Kajiwara, Jiro ; Moloney, Gerard S.
Agent name :
Address for service :
Filing date :: 21 January 2003
Associated companies :
Applicant name :: MULTI PLANAR TECHNOLOGIES, INC.
Applicant address :: 45 E. Plumeria Drive, San Jose, CA 95134
Old name :
Original Source :: Go

Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution A Standard patent application filed on 21 January 2003 credited to Kajiwara, Jiro ; Moloney, Gerard S.