Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
A Standard patent application filed on 26 March 2002 credited to Hansen, David A. ; Kajiwara, Jiro ; Wang, Huey-Ming ; Moloney, Gerard S.

Details

Application number :
2002252516  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal  
Inventor :
Hansen, David A. ; Kajiwara, Jiro ; Wang, Huey-Ming ; Moloney, Gerard S.  
Agent name :
 
Address for service :
 
Filing date :
26 March 2002  
Associated companies :
 
Applicant name :
MULTI-PLANAR TECHNOLOGIES, INC.  
Applicant address :
45 E. Plumeria Drive, San Jose, CA 95134  
Old name :
 
Original Source :
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