Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
A Standard patent application filed on 30 August 2001 credited to Hansen, David A. ; Kajiwara, Jiro ; Wang, Huey-Ming ; Moloney, Gerard S.

Details

Application number :
2001286972  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby  
Inventor :
Hansen, David A. ; Kajiwara, Jiro ; Wang, Huey-Ming ; Moloney, Gerard S.  
Agent name :
 
Address for service :
 
Filing date :
30 August 2001  
Associated companies :
 
Applicant name :
Multi-Planar Technologies, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor