Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
A Standard patent application filed on 31 May 2002 credited to Moloney, Gerard S. ; Yang, Junsheng ; Kajiwara, Jiro ; Wang, Huey-Ming

Details

Application number :

2002345427  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface  

Inventor :

Moloney, Gerard S. ; Yang, Junsheng ; Kajiwara, Jiro ; Wang, Huey-Ming  

Agent name :

 

Address for service :

 

Filing date :

31 May 2002  

Associated companies :

 

Applicant name :

MULTI PLANAR TECHNOLOGIES, INC.  

Applicant address :

45 E. Plumeria Drive, San Jose, CA 95134  

Old name :

 

Original Source :

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