Conductive structure for use in multi-level metallization and process
A Standard patent application filed on 06 December 2000 credited to Basol, Bulent ; Talieh, Homayoun ; Uzoh, Cyprian

Details

Application number :
2001247109  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Conductive structure for use in multi-level metallization and process  
Inventor :
Basol, Bulent ; Talieh, Homayoun ; Uzoh, Cyprian  
Agent name :
 
Address for service :
 
Filing date :
06 December 2000  
Associated companies :
 
Applicant name :
Nutool, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor