Apparatus and method for sputter depositing dielectric films on a substrate
A Standard patent application filed on 21 May 1998 credited to Lantsman, Alexander D

Details

Application number :

75918  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Apparatus and method for sputter depositing dielectric films on a substrate  

Inventor :

Lantsman, Alexander D  

Agent name :

 

Address for service :

 

Filing date :

21 May 1998  

Associated companies :

 

Applicant name :

Tokyo Electron Limited  

Applicant address :

TBS Broadcast Center 3-6 Akasaka 5-chome Minato-ku Tokyo 105 Japan  

Old name :

 

Original Source :

Go  

Same Inventor

• Soft plasma ignition in plasma processing chambers
• Plasma sputter etching system with reduced particle contamin ation
• Plasma noise and arcing suppressor apparatus and method for sputter...
• Plasma processing system with reduced particle contamination
• Inductively coupled plasma sputter chamber with conductive material...