Inductively coupled plasma sputter chamber with conductive material sputtering capabilities
A Standard patent application filed on 28 November 1994 credited to Bayer, Robert ; Seirmarco, James A ; Lantsman, Alexander D

Details

Application number :

13328  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Inductively coupled plasma sputter chamber with conductive material sputtering capabilities  

Inventor :

Bayer, Robert ; Seirmarco, James A ; Lantsman, Alexander D  

Agent name :

 

Address for service :

 

Filing date :

28 November 1994  

Associated companies :

 

Applicant name :

Materials Research Corporation  

Applicant address :

 

Old name :

 

Original Source :

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