Multilayer substrate with built-in coil, semiconductor chip, methods for manufacturing them
A Standard patent application filed on 28 May 2003 credited to Oshimura, Masahiko ; Sagawa, Kouichirou

Details

Application number :
2003241820  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Multilayer substrate with built-in coil, semiconductor chip, methods for manufacturing them  
Inventor :
Oshimura, Masahiko ; Sagawa, Kouichirou  
Agent name :
 
Address for service :
 
Filing date :
28 May 2003  
Associated companies :
 
Applicant name :
AJINOMOTO CO., INC.  
Applicant address :
15-1, Kyobashi 1-Chome, Chuo-Ku, Tokyo 104-0031  
Old name :
 
Original Source :
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Same Inventor