Shielding wire in multilayer board, semiconductor chip, electronic circuit element, and method for producing the same
A Standard patent application filed on 28 May 2003 credited to Oshimura, Masahiko ; Sagawa, Kouichirou

Details

Application number :
2003241819  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Shielding wire in multilayer board, semiconductor chip, electronic circuit element, and method for producing the same  
Inventor :
Oshimura, Masahiko ; Sagawa, Kouichirou  
Agent name :
 
Address for service :
 
Filing date :
28 May 2003  
Associated companies :
 
Applicant name :
AJINOMOTO CO., INC.  
Applicant address :
15-1, Kyobashi 1-Chome, Chuo-Ku, Tokyo 104-0031  
Old name :
 
Original Source :
Go  

Same Inventor