Variable inductive element, multilayer substrate with built-in variable inductive element, semiconductor chip, and chip variable inductive element
A Standard patent application filed on 29 August 2003 credited to Sagawa, Kouichirou
;
Ichikawa, Yuichi
;
Oshimura, Masahiko
Details
Application number :
2003261832
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Variable inductive element, multilayer substrate with built-in variable inductive element, semiconductor chip, and chip variable inductive element