Method of recycling package-cushioning material, and pellets and injection-molded articles made therefrom
A Standard patent application filed on 27 August 1998 credited to Kim, Jung Ho

Details

Application number :
90048  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method of recycling package-cushioning material, and pellets and injection-molded articles made therefrom  
Inventor :
Kim, Jung Ho  
Agent name :
 
Address for service :
 
Filing date :
27 August 1998  
Associated companies :
 
Applicant name :
Samsung Electronics Co., Ltd.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor