Dual-Interface IC card by laminating a plurality of foils and method of same
A Standard patent application filed on 13 February 2003 credited to Kim, Jung Ho
;
Yu, Hong Jun
Details
Application number :
2003208049
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Dual-Interface IC card by laminating a plurality of foils and method of same
Inventor :
Kim, Jung Ho
;
Yu, Hong Jun
Agent name :
Hodgkinson McInnes Patents
Address for service :
Level 21 201 Elizabeth Street Sydney NSW 2000 Australia
Filing date :
13 February 2003
Associated companies :
Applicant name :
JT Corp
Applicant address :
610-12 Namchon-dong, Namdong-gu Incheongwangyeok-si 405-100 Republic of Korea