Method and apparatus for metallizing high aspect ratio silicon semiconductor device contacts
A Standard patent application filed on 11 December 1997 credited to Hillman, Joseph T ; Ameen, Michael S.

Details

Application number :
57994  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method and apparatus for metallizing high aspect ratio silicon semiconductor device contacts  
Inventor :
Hillman, Joseph T ; Ameen, Michael S.  
Agent name :
 
Address for service :
 
Filing date :
11 December 1997  
Associated companies :
 
Applicant name :
Materials Research Corporation  
Applicant address :
 
Old name :
 
Original Source :
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Same Inventor