Polishing compound for chemimechanical polishing and method for polishing substrate
A Standard patent application filed on 17 August 2000 credited to Kurata, Yasushi ; Kamigata, Yasuo ; Igarashi, Akiko ; Terasaki, Hiroki ; Uchida, Takeshi

Details

Application number :

65942  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polishing compound for chemimechanical polishing and method for polishing substrate  

Inventor :

Kurata, Yasushi ; Kamigata, Yasuo ; Igarashi, Akiko ; Terasaki, Hiroki ; Uchida, Takeshi  

Agent name :

 

Address for service :

 

Filing date :

17 August 2000  

Associated companies :

 

Applicant name :

Hitachi Chemical Company, Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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Same Inventor

• Polishing compound for chemimechanical polishing and polishing method