Method for applying a moistureproof coating to printed circuit boards using triangular or dovetail shaped liquid film emitted from a flat-pattern nozzle
A Standard patent application filed on 02 June 1989 credited to Shimada, Takaji
Details
Application number :
36020
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Method for applying a moistureproof coating to printed circuit boards using triangular or dovetail shaped liquid film emitted from a flat-pattern nozzle
Inventor :
Shimada, Takaji
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
02 June 1989
Associated companies :
Applicant name :
Nordson Corporation
Applicant address :
28601 Clemens Road Westlake Ohio 44145-1148 U.S.A.