Method for applying a film coating of a liquid hot solder resist agent and a resist composition for use with the method
A Standard patent application filed on 31 August 1988 credited to Shimada, Takaji
Details
Application number :
23066
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method for applying a film coating of a liquid hot solder resist agent and a resist composition for use with the method
Inventor :
Shimada, Takaji
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
31 August 1988
Associated companies :
Applicant name :
Nordson Corporation
Applicant address :
28601 Clemens Road, Westlake, OH 44145 United States of America