Improved integrated circuit package and method of manufacturing the integrated circuit package
A Standard patent application filed on 24 June 2003 credited to Yee, Lin Tsui ; Pedron, Serafin Jr. ; Mclellan, Neil Robert

Details

Application number :

2003278855  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Improved integrated circuit package and method of manufacturing the integrated circuit package  

Inventor :

Yee, Lin Tsui ; Pedron, Serafin Jr. ; Mclellan, Neil Robert  

Agent name :

 

Address for service :

 

Filing date :

24 June 2003  

Associated companies :

 

Applicant name :

YEE, Lin, Tsui  

Applicant address :

Room 1510, Yiu Tung House, Tung Tau Estate, K/N, Hong Kong  

Old name :

 

Original Source :

Go  

Same Inventor

• Method of manufacturing an encapsulated integrated circuit package