Method of manufacturing an encapsulated integrated circuit package

Application number :: 2003224606
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Method of manufacturing an encapsulated integrated circuit package
Inventor :: Fan, Chun Ho ; Yee, Lin Tsui ; Pedron, Serafin Jr. ; Mclellan, Neil Robert ; Jerro, Luk Chung Ho
Agent name :
Address for service :
Filing date :: 31 January 2003
Associated companies :
Applicant name :: YEE, Lin, Tsui
Applicant address :: Room 1510, Yiu Tung House, Tung Tau Estate, K/N, Hong Kong
Old name :
Original Source :: Go

Method of manufacturing an encapsulated integrated circuit package A Standard patent application filed on 31 January 2003 credited to Fan, Chun Ho ; Yee, Lin Tsui ; Pedron, Serafin Jr. ; Mclellan, Neil Robert ; Jerro, Luk Chung Ho