Details
- Application number :
- 2003243715
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Thermal interface materials
- Inventor :
- Nguyen, My
;
Le, Kim-Chi
- Agent name :
-
- Address for service :
-
- Filing date :
- 19 June 2003
- Associated companies :
-
- Applicant name :
- HONEYWELL INTERNATIONAL INC.
- Applicant address :
- PO Box 2245, 101 Columbia Road, Morristown, NJ 07962
- Old name :
-
- Original Source :
- Go