Thermal interface material and electronic assembly having such a thermal interface material
A Standard patent application filed on 17 October 2002 credited to Dani, Ashay ; Jayaraman, Saikumar ; Koning, Paul ; Rumer, Christopher

Details

Application number :

2002349963  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Thermal interface material and electronic assembly having such a thermal interface material  

Inventor :

Dani, Ashay ; Jayaraman, Saikumar ; Koning, Paul ; Rumer, Christopher  

Agent name :

 

Address for service :

 

Filing date :

17 October 2002  

Associated companies :

 

Applicant name :

INTEL CORPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

Go