Method and apparatus of sealing wafer backside for full-face electrochemical plating
A Standard patent application filed on 30 May 2003 credited to Basol, Bulent M. ; Volodarsky, Konstantin ; Ashjaee, Jalal ; Talieh, Homayoun

Details

Application number :

2003238863  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus of sealing wafer backside for full-face electrochemical plating  

Inventor :

Basol, Bulent M. ; Volodarsky, Konstantin ; Ashjaee, Jalal ; Talieh, Homayoun  

Agent name :

 

Address for service :

 

Filing date :

30 May 2003  

Associated companies :

 

Applicant name :

NUTOOL, INC.  

Applicant address :

1655 McCandless Drive, Milpitas, CA 95035  

Old name :

 

Original Source :

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• Method of sealing wafer backside for full-face electronchemical...