Method of sealing wafer backside for full-face electronchemical plating

Application number :: 2002248527
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Method of sealing wafer backside for full-face electronchemical plating
Inventor :: Basol, Bulent ; Volodarsky, Konstantin ; Ashjaee, Jalal ; Talieh, Homayoun
Agent name :
Address for service :
Filing date :: 27 February 2002
Associated companies :
Applicant name :: NUTOOL, INC.
Applicant address :: 1645 McCandless Drive, Milpitas, CA 95035
Old name :
Original Source :: Go

Method of sealing wafer backside for full-face electronchemical plating A Standard patent application filed on 27 February 2002 credited to Basol, Bulent ; Volodarsky, Konstantin ; Ashjaee, Jalal ; Talieh, Homayoun