Heat dissipation device
A Standard patent application filed on 01 February 2002 credited to Lian, Bin
;
Dishongh, Terrance J.
;
Dujari, Prateek
;
Searls, Damion T.
Details
Application number :
2002242037
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Heat dissipation device
Inventor :
Lian, Bin
;
Dishongh, Terrance J.
;
Dujari, Prateek
;
Searls, Damion T.
Agent name :
Address for service :
Filing date :
01 February 2002
Associated companies :
Applicant name :
INTEL CORPORATION
Applicant address :
2200 Mission College Boulevard, Santa Clara, CA 95052