A high-performance fin configuration for air-cooled heat dissipation device
A Standard patent application filed on 31 October 2001 credited to Lee, Seri ; Pollard, Lloyd

Details

Application number :
2002225846  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
A high-performance fin configuration for air-cooled heat dissipation device  
Inventor :
Lee, Seri ; Pollard, Lloyd  
Agent name :
 
Address for service :
 
Filing date :
31 October 2001  
Associated companies :
 
Applicant name :
Intel Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor