High performance air cooled heat sinks used in high density packaging applications
A Standard patent application filed on 25 April 2002 credited to Randleman, Craig ; Lee, Seri ; Pollard, Lloyd

Details

Application number :

2002308514  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High performance air cooled heat sinks used in high density packaging applications  

Inventor :

Randleman, Craig ; Lee, Seri ; Pollard, Lloyd  

Agent name :

 

Address for service :

 

Filing date :

25 April 2002  

Associated companies :

 

Applicant name :

INTEL CORPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

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