Structural reinforcement of highly porous low k dielectric films by cu diffusion barrier structures
A Standard patent application filed on 18 December 2001 credited to Wong, Lawrence D.

Details

Application number :
2002231330  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Structural reinforcement of highly porous low k dielectric films by cu diffusion barrier structures  
Inventor :
Wong, Lawrence D.  
Agent name :
 
Address for service :
 
Filing date :
18 December 2001  
Associated companies :
 
Applicant name :
Intel Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor