Structural reinforcement of highly porous low k dielectric films by ild posts
A Standard patent application filed on 20 November 2001 credited to Wong, Lawrence D.
Details
Application number :
2002217931
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Structural reinforcement of highly porous low k dielectric films by ild posts
Inventor :
Wong, Lawrence D.
Agent name :
Address for service :
Filing date :
20 November 2001
Associated companies :
Applicant name :
INTEL CORPORATION
Applicant address :
2200 Mission College Boulevard, Santa Clara, CA 95052