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Surface mount connector lead
A Standard patent application filed on 12 October 2001 credited to Lian, Bin ; Dishongh, Terrance ; Dujari, Prateek ; Searls, Damion
Details
Application number :
2002211645
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Surface mount connector lead
Inventor :
Lian, Bin ; Dishongh, Terrance ; Dujari, Prateek ; Searls, Damion
Agent name :
Address for service :
Filing date :
12 October 2001
Associated companies :
Applicant name :
Intel Corporation
Applicant address :
Old name :
Original Source :
Go
Same Inventor
Circuit card assembly having controlled expansion properties
Heat dissipation device
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