Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
A Standard patent application filed on 22 August 2001 credited to Saldana, Miguel A. ; Williams, Damon Vincent

Details

Application number :
2001285226  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate  
Inventor :
Saldana, Miguel A. ; Williams, Damon Vincent  
Agent name :
 
Address for service :
 
Filing date :
22 August 2001  
Associated companies :
 
Applicant name :
Lam Research Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor