Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
A Standard patent application filed on 18 April 2001 credited to Nagorski, Boguslaw A. ; Basol, Bulent M. ; Ashjaee, Jalal ; Talieh, Homayoun ; Uzoh, Cyprian

Details

Application number :

2001253635  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing  

Inventor :

Nagorski, Boguslaw A. ; Basol, Bulent M. ; Ashjaee, Jalal ; Talieh, Homayoun ; Uzoh, Cyprian  

Agent name :

 

Address for service :

 

Filing date :

18 April 2001  

Associated companies :

 

Applicant name :

Nutool, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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