High speed flip chip assembly process
A Standard patent application filed on 04 April 2001 credited to Mahan, Bruce P. ; Piacitelli, Christopher J. ; Price, David M. ; Huot, Shaun ; Hammond, James S. ; Wistey, John G. ; Cao, Miao-Yong ; Larson, Gary R.

Details

Application number :

2001253142  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High speed flip chip assembly process  

Inventor :

Mahan, Bruce P. ; Piacitelli, Christopher J. ; Price, David M. ; Huot, Shaun ; Hammond, James S. ; Wistey, John G. ; Cao, Miao-Yong ; Larson, Gary R.  

Agent name :

 

Address for service :

 

Filing date :

04 April 2001  

Associated companies :

 

Applicant name :

Parlex Corporation  

Applicant address :

 

Old name :

 

Original Source :

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