Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adaptedfor chemical-mechanical polishing with a fixed abrasive pad
A Standard patent application filed on 10 November 1999 credited to Chopra, Dinesh

Details

Application number :
17245  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adaptedfor chemical-mechanical polishing with a fixed abrasive pad  
Inventor :
Chopra, Dinesh  
Agent name :
 
Address for service :
 
Filing date :
10 November 1999  
Associated companies :
 
Applicant name :
Micron Technology, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor