Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same
A Standard patent application filed on 12 April 2001 credited to Tsujino, Fumio ; Kido, Takanori

Details

Application number :

48756  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same  

Inventor :

Tsujino, Fumio ; Kido, Takanori  

Agent name :

 

Address for service :

 

Filing date :

12 April 2001  

Associated companies :

 

Applicant name :

Showa Denko Kabushiki Kaisha  

Applicant address :

 

Old name :

 

Original Source :

Go