Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
A Standard patent application filed on 27 December 2000 credited to Hosomi, Takeshi ; Takahashi, Toyosei ; Nakamura, Kensuke ; Okada, Ryouichi

Details

Application number :

24036  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device  

Inventor :

Hosomi, Takeshi ; Takahashi, Toyosei ; Nakamura, Kensuke ; Okada, Ryouichi  

Agent name :

 

Address for service :

 

Filing date :

27 December 2000  

Associated companies :

 

Applicant name :

Sumitomo Bakelite Company Limited  

Applicant address :

 

Old name :

 

Original Source :

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