Method and compositions for metallizing microvias and high density interconnectsin photodefined dielectrics
A Standard patent application filed on 30 September 1998 credited to Kydd, Paul H.

Details

Application number :
95932  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method and compositions for metallizing microvias and high density interconnectsin photodefined dielectrics  
Inventor :
Kydd, Paul H.  
Agent name :
 
Address for service :
 
Filing date :
30 September 1998  
Associated companies :
 
Applicant name :
Partnerships Limited, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor