Wet strength thermosetting resin formulations and polyaminamide polym ers suitable for use in the manufacture of paper products
A Standard patent application filed on 13 August 1998 credited to Post, Elroy Wayne
;
Kokko, Bruce Jerome
Details
Application number :
87819
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Wet strength thermosetting resin formulations and polyaminamide polym ers suitable for use in the manufacture of paper products
Inventor :
Post, Elroy Wayne
;
Kokko, Bruce Jerome
Agent name :
Address for service :
Filing date :
13 August 1998
Associated companies :
Applicant name :
Fort James Corporation
Applicant address :
1650 Lake Cook Rd. Deerfield, Illnois 60015 United States Of America