Method of drying semiconductor wafers using hot deionized water and infrared drying
A Standard patent application filed on 05 August 1998 credited to Nakano, Masami ; Danh, Jaclyn

Details

Application number :

87672  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of drying semiconductor wafers using hot deionized water and infrared drying  

Inventor :

Nakano, Masami ; Danh, Jaclyn  

Agent name :

 

Address for service :

 

Filing date :

05 August 1998  

Associated companies :

 

Applicant name :

Seh America, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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