Case assembly including adhesive bond that is insensitive to high operating pressures and exhibits inherent high temperature relief capability, and mot or assembly and rocket assembly including the same
A Standard patent application filed on 27 February 1998 credited to Wright, Roger D.
;
Crook, Russell A.
;
Kliger, Joseph J.
Details
Application number :
87553
Application type :
Standard
Application status :
WITHDRAWN
Under opposition :
No
Proceeding type :
Invention title :
Case assembly including adhesive bond that is insensitive to high operating pressures and exhibits inherent high temperature relief capability, and mot or assembly and rocket assembly including the same
Inventor :
Wright, Roger D.
;
Crook, Russell A.
;
Kliger, Joseph J.