Manifold provided with thermoelectric module therein
A Standard patent application filed on 12 August 1998 credited to Nakamoto, Masafumi
;
Miyake, Kazumasa
;
Arakawa, Toshikazu
;
Shimada, Masuo
Details
Application number :
86477
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Manifold provided with thermoelectric module therein