A method of mounting a semiconductor die on a printed circuit board
A Standard patent application filed on 02 June 1998 credited to Zhong, Zhaowei ; Kang, Raymond

Details

Application number :

76834  

Application type :

Standard  

Application status :

WITHDRAWN  

Under opposition :

No  

Proceeding type :

 

Invention title :

A method of mounting a semiconductor die on a printed circuit board  

Inventor :

Zhong, Zhaowei ; Kang, Raymond  

Agent name :

 

Address for service :

 

Filing date :

02 June 1998  

Associated companies :

 

Applicant name :

Siemens Audiologische Technik GmbH  

Applicant address :

 

Old name :

 

Original Source :

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