A system and method for packaging integrated circuits

Application number :: 75966
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: A system and method for packaging integrated circuits
Inventor :: Goetz, Martin P. ; Brown, Sammy K. ; Beal, Samuel W. ; Wiggin, Andrew K. ; Todd, Tom L. ; Avery, George E.
Agent name :
Address for service :
Filing date :: 22 May 1998
Associated companies :
Applicant name :: Alpine Microsystems, Inc.
Applicant address :
Old name :
Original Source :: Go

A system and method for packaging integrated circuits A Standard patent application filed on 22 May 1998 credited to Goetz, Martin P. ; Brown, Sammy K. ; Beal, Samuel W. ; Wiggin, Andrew K. ; Todd, Tom L. ; Avery, George E.