Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics
A Standard patent application filed on 22 November 2000 credited to Darcangelo, Charles M. ; Sabia, Robert ; Ukrainczyk, Ljerka ; Stevens, Harrie J. ; Sell, Robert D

Details

Application number :

19258  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics  

Inventor :

Darcangelo, Charles M. ; Sabia, Robert ; Ukrainczyk, Ljerka ; Stevens, Harrie J. ; Sell, Robert D  

Agent name :

 

Address for service :

 

Filing date :

22 November 2000  

Associated companies :

 

Applicant name :

Corning Incorporated  

Applicant address :

 

Old name :

 

Original Source :

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