Semiconductor wafer fabrication of die-bottom contacts for electronic devices
A Standard patent application filed on 26 January 1998 credited to Chen, Changsheng ; Young, James L. ; Sander, Wendell B. ; Marcoux, Phil P.

Details

Application number :

62512  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor wafer fabrication of die-bottom contacts for electronic devices  

Inventor :

Chen, Changsheng ; Young, James L. ; Sander, Wendell B. ; Marcoux, Phil P.  

Agent name :

 

Address for service :

 

Filing date :

26 January 1998  

Associated companies :

 

Applicant name :

Chipscale, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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