Thermosetting encapsulants for electronics packaging
A Standard patent application filed on 15 December 1997 credited to Wong, Pui Kwan ; Iyer, Shridhar Ratnaswamy

Details

Application number :

57613  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Thermosetting encapsulants for electronics packaging  

Inventor :

Wong, Pui Kwan ; Iyer, Shridhar Ratnaswamy  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

15 December 1997  

Associated companies :

 

Applicant name :

Shell Internationale Research Maatschappij B.V.  

Applicant address :

Carel Van Bylandtlaan 30 NL-2596 HR The Hague The Netherlands  

Old name :

 

Original Source :

Go  

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