Pressure seal spot pattern for c-fold mailer
A Standard patent application filed on 15 July 1997 credited to Lombardo, Leo

Details

Application number :

37276  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Pressure seal spot pattern for c-fold mailer  

Inventor :

Lombardo, Leo  

Agent name :

 

Address for service :

 

Filing date :

15 July 1997  

Associated companies :

 

Applicant name :

Moore Business Forms, Inc.  

Applicant address :

 

Old name :

 

Original Source :

Go  

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