Quickly disintegrable compression-molded materials and process for producing the same
A Standard patent application filed on 10 July 1997 credited to Murakami, Toshio ; Ueno, Naoto ; Aritomi, Hideaki

Details

Application number :

34587  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Quickly disintegrable compression-molded materials and process for producing the same  

Inventor :

Murakami, Toshio ; Ueno, Naoto ; Aritomi, Hideaki  

Agent name :

PHILLIPS ORMONDE FITZPATRICK  

Address for service :

367 Collins Street MELBOURNE VIC 3000  

Filing date :

10 July 1997  

Associated companies :

 

Applicant name :

Daiichi Pharmaceutical Co., Ltd.  

Applicant address :

14-10 Nihonbashi 3-chome Chuo-ku Tokyo 103 Japan  

Old name :

 

Original Source :

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