Method and apparatus for contactless treatment of a semiconductor substrate in wafer form
A Standard patent application filed on 08 July 1997 credited to Huussen, Frank ; Granneman, Ernst Hendrik August

Details

Application number :

33617  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for contactless treatment of a semiconductor substrate in wafer form  

Inventor :

Huussen, Frank ; Granneman, Ernst Hendrik August  

Agent name :

 

Address for service :

 

Filing date :

08 July 1997  

Associated companies :

 

Applicant name :

Advanced Semiconductor Materials International N.V.  

Applicant address :

 

Old name :

 

Original Source :

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