High performance epoxide compositions for die attach and polymer bump applications
A Standard patent application filed on 04 December 1996 credited to

Details

Application number :

11295  

Application type :

Standard  

Application status :

WITHDRAWN  

Under opposition :

No  

Proceeding type :

 

Invention title :

High performance epoxide compositions for die attach and polymer bump applications  

Inventor :

 

Agent name :

 

Address for service :

 

Filing date :

04 December 1996  

Associated companies :

 

Applicant name :

Polyset Company, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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