Semiconductor wafer processing adhesives and tapes
A Standard patent application filed on 13 June 1996 credited to Bennett, Richard E.
;
Rudin, Eleanor
;
Nestegard, Mark K
;
Bird, Gearld C.
Details
Application number :
61775
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Semiconductor wafer processing adhesives and tapes
Inventor :
Bennett, Richard E.
;
Rudin, Eleanor
;
Nestegard, Mark K
;
Bird, Gearld C.
Agent name :
Davies Collison Cave
Address for service :
GPO Box 3876 SYDNEY NSW 2001
Filing date :
13 June 1996
Associated companies :
Applicant name :
Minnesota Mining and Manufacturing Company
Applicant address :
3M Center P.O. Box 33427 Saint Paul MN 55133-3427 United States Of America