Semiconductor device mounting method and multi-chip module produced by the same
A Standard patent application filed on 14 June 1996 credited to Shirakawa, Hirotsugo ; Kouda, Tsunenobu ; Tanaka, Yasunori

Details

Application number :

55995  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor device mounting method and multi-chip module produced by the same  

Inventor :

Shirakawa, Hirotsugo ; Kouda, Tsunenobu ; Tanaka, Yasunori  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

14 June 1996  

Associated companies :

 

Applicant name :

NEC Corporation  

Applicant address :

7-1 Shiba 5-chome Minato-ku Tokyo Japan  

Old name :

 

Original Source :

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